3D Heterogeneous Integration Alliance | Yokohama National University

3D Heterogeneous Integration Alliance

The Alliance responsible for the semiconductor industry’s revitalization

Notice and report

ALL

We held an Open Seminar

2024.02.21

The 4th 3DHI Seminar will be held

2024.02.06

For those who have applied for the 3DHI Open Seminar

2024.02.05

NEWS

The 4th 3DHI Seminar will be held

2024.02.06

For those who have applied for the 3DHI Open Seminar

2024.02.05

We will support the Open Seminar held by The Japan Institute of Electronics Packaging [JIEP]

2023.12.06

REPORT

We held an Open Seminar

2024.02.21

The 3rd 3DHI Seminar was held

2023.11.22

About us

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What is 3DHI?

3DHI is a 3D Heterogeneous Integration Alliance, which was established with the aim of contributing to the semiconductor industry through collaboration between industry, government and academia.

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Activity Content

3DHI will host events to introduce the latest trends in 3D hetero-integrated devices. We also provide a place where members may discuss and share ideas.

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