The 3rd 3DHI Open Seminar will be held
Announcement of the 3rd 3DHI Open Seminar.
We are pleased to announce that the 3rd Open Seminar will be held as follows. This event will showcase the outstanding technologies and products of our members’ companies. In addition to presentations from each company, an exhibition will be held. We encourage you to participate!
Event Details:
Date & Time: Thursday, May 15, 2025, 13:00–18:40
Format: In-person only (Limited to the first 200 participants)
Venue: Yokohama Grand InterContinental Hotel
Access Information | Yokohama Grand InterContinental Hotel
※ The application URL is provided at the end of this notice. Please use the link to register.
Tentative Agenda (Japanese version only)
Participation Details:
Capacity: 200 participants (Registration will close once capacity is reached)
Participation Fee: Free
Important Notes:
- Upon successful registration, a QR code for entry will be sent. Please print it out or save it on your smartphone and present it at the reception.
- This seminar will not be available online, so please attend in person.
※ Please note that this seminar will be conducted exclusively in Japanese, and no simultaneous English translation will be provided.
Registration:
Please register using the link bellow (Japanese version only)
https://forms.office.com/r/jMsQdj4SAi
For Inquiries:
3D Heterogeneous Integration Alliance (3DHI) Secretariat
E-mail: 3dhi-info\ynu.ac.jp (Replace “\” with “@”)
Supporting Organization:
The Japan Institute of Electronics Packaging (JIEP)
