The present semiconductor Integrated Circuits (ICs) require high performance and low power consumption due to the necessity for constant improvements in autonomous driving, AI, etc. There is a tendency to increase the levels of integration, which will demand manufacturing equipped with expensive equipment, significant research and development costs, and mass production investments. On the other hand, the limits of miniaturization of semiconductor devices have been pointed out, and 3D integration technology is gaining a lot of attention.
“3D integration technology” is a technology that layers up IC chiplets to achieve high integration, high speed, and low power consumption. The 3D Heterogeneous Integration Alliance, abbreviated as “3DHI Alliance”, aims to bring together industry-government-academia collaboration activities and contribute to the semiconductor industry through collaboration between interested domestic and international universities, public-private research organizations, and companies.
In April 2023, HIYA at Yokohama National University and 3DPI at Osaka Metropolitan University merged and restarted as the 3DHI Alliance.
